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1 Ergebnisse
1
Capillary-activated scalable microporous copper microchanne..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Dewanjee, Sujan
;
Singhal, Gaurav S.
;
Li, Jiaqi
... - p. 01-10 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177496
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Capillary-activated scalable microporous copper microchannels for two-phase thermal management of semiconductor materials</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177496&Exemplar=1&LAN=DE A1 Dewanjee, Sujan A1 Singhal, Gaurav S. A1 Li, Jiaqi A1 Lohan, Danny A1 Joshi, Shailesh N. A1 Braun, Paul V. A1 Miljkovic, Nenad YR 2023 SN 2694-2135 K1 Fabrication K1 Thermal management of electronics K1 Performance evaluation K1 Silicon carbide K1 Coolants K1 Silicon K1 Copper K1 Microchannels K1 capillary activated K1 thermal management K1 wickability K1 wettability SP 01 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177496 DO https://doi.org/10.1109/ITherm55368.2023.10177496 SF ELIB - SuUB Bremen
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