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Study on evaluation of durability of through-hole solder jo..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Kon, Masahiro ; Yu, Qiang ; Tsuyuki, Tomohiro - p. 1-8 , 2023
Link: https://doi.org/10.1109/ITherm55368.2023.10177509