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1 Ergebnisse
1
Test device design and test procedure for non-destructive c..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Jois, Chetan
;
Chou, Pei-En
;
Prasad, Sudarshan Prasanna
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177512
RT T1
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
: T1
Test device design and test procedure for non-destructive characterization of Bi phase accumulation during electromigration
UL https://suche.suub.uni-bremen.de/peid=ieee-10177512&Exemplar=1&LAN=DE A1 Jois, Chetan A1 Chou, Pei-En A1 Prasad, Sudarshan Prasanna A1 Handwerker, Carol A1 Subbarayan, Ganesh YR 2023 SN 2694-2135 K1 Temperature sensors K1 Electromigration K1 Resistance K1 Microscopy K1 Kelvin K1 Thermomechanical processes K1 Microelectronics K1 Low Temperature Solder K1 Material Characterization SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177512 DO https://doi.org/10.1109/ITherm55368.2023.10177512 SF ELIB - SuUB Bremen
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