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1 Ergebnisse
1
Singular Value Decomposition (SVD) based Thermal Resistance..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Jo, Hyungyung
;
Lee, Heeseok
;
Kim, Heonwoo
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177524
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Singular Value Decomposition (SVD) based Thermal Resistance Matrix (TRM) Size Reduction for Fast Optimization of On-Die Floorplan and Temperature Sensor Placement</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177524&Exemplar=1&LAN=DE A1 Jo, Hyungyung A1 Lee, Heeseok A1 Kim, Heonwoo A1 Cho, Young-Sang A1 Yoo, Jongkyu A1 Pak, Junso YR 2023 SN 2694-2135 K1 Temperature sensors K1 Systematics K1 Thermal resistance K1 Thermal decomposition K1 Thermomechanical processes K1 Transmission line measurements K1 System-on-chip K1 Thermal Resistance Matrix (TRM) K1 temperature sensor K1 on-die temperature sensor K1 thermal sensor K1 thermal-aware SOC design SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177524 DO https://doi.org/10.1109/ITherm55368.2023.10177524 SF ELIB - SuUB Bremen
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