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1 Ergebnisse
1
Implementation of a Topologically Optimized Heat Sink for N..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Palumbo, Joshua
;
Tayyara, Omri
;
Assadi, Seyed Amir
... - p. 1-8 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177542
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Implementation of a Topologically Optimized Heat Sink for Non-Uniform Heat Fluxes in an Electric-Vehicle Fast-Charger</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177542&Exemplar=1&LAN=DE A1 Palumbo, Joshua A1 Tayyara, Omri A1 Assadi, Seyed Amir A1 Da Silva, Carlos M. A1 Trescases, Olivier A1 Amon, Cristina H. A1 Chandra, Sanjeev YR 2023 SN 2694-2135 K1 Thermal management of electronics K1 Thermal resistance K1 Surface resistance K1 Thermal spraying K1 Three-dimensional printing K1 Topology K1 Power semiconductor devices K1 Heat Sink K1 Thermal Management K1 Electric-Vehicle Fast Charger K1 Topology Optimization K1 Thermal Spray SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177542 DO https://doi.org/10.1109/ITherm55368.2023.10177542 SF ELIB - SuUB Bremen
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