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1 Ergebnisse
1
A Novel Scalable Modular Immersion Cooling System Architect..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Chen, Carrie
;
Wu, Jiahong
;
Zhang, Jun
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177547
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>A Novel Scalable Modular Immersion Cooling System Architecture for Sustainable Data Center</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177547&Exemplar=1&LAN=DE A1 Chen, Carrie A1 Wu, Jiahong A1 Zhang, Jun A1 Lo, Ying-Shan A1 Liang, Allen A1 Hung, Checa A1 Ahuja, Nishi A1 Qiao, Qing YR 2023 SN 2694-2135 K1 Data centers K1 Liquid cooling K1 Thermal resistance K1 Thermomechanical processes K1 Systems architecture K1 Immersion cooling K1 Servers K1 Immersion Cooling K1 Single-Phase Immersion K1 TDP K1 CDU K1 Uniform Flow Module K1 Sustainability K1 Data Center SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177547 DO https://doi.org/10.1109/ITherm55368.2023.10177547 SF ELIB - SuUB Bremen
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