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1 Ergebnisse
1
Advanced Cold Plate Liquid Cooling Solution for Hyper-scale..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Gui, Chenglong
;
Wang, Yulong
;
Shen, Chen
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177549
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Advanced Cold Plate Liquid Cooling Solution for Hyper-scale Data Center Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177549&Exemplar=1&LAN=DE A1 Gui, Chenglong A1 Wang, Yulong A1 Shen, Chen A1 Wang, Shifeng A1 Wang, Ruidong A1 Lv, Zhichao A1 Lin, Bin A1 Tian, Wenbin A1 Li, Zhiming A1 Zhang, Xu A1 Zhang, Ken A1 Wu, Lihui A1 Ahuja, Nishi YR 2023 SN 2694-2135 K1 Data centers K1 Cloud computing K1 Liquid cooling K1 Power demand K1 Cold plates K1 Graphics processing units K1 Lakes K1 Cold Plate K1 Liquid Cooling K1 Data Center K1 Cloud Computing and PUE SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177549 DO https://doi.org/10.1109/ITherm55368.2023.10177549 SF ELIB - SuUB Bremen
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