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1
Liquid jet impingement cooling of high-performance interpos..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Oprins, H.
;
Wei, Tiwei
;
Cherman, Vladimir
. - p. 1-10 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177551
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD – FEM modeling study</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177551&Exemplar=1&LAN=DE A1 Oprins, H. A1 Wei, Tiwei A1 Cherman, Vladimir A1 Beyne, E. YR 2023 SN 2694-2135 K1 Temperature sensors K1 Semiconductor device modeling K1 Solid modeling K1 Three-dimensional displays K1 Sensitivity K1 Computational modeling K1 Computational fluid dynamics K1 3D stacking 2.5D interposer K1 jet impingement cooling K1 thermal modeling SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177551 DO https://doi.org/10.1109/ITherm55368.2023.10177551 SF ELIB - SuUB Bremen
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