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1 Ergebnisse
1
Investigation on Advanced Cold Plate Liquid Cooling Solutio..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Tan, Xianguang
;
Liu, Hongmei
;
Zhang, Jiajun
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177559
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Investigation on Advanced Cold Plate Liquid Cooling Solution for Large Scale Application in Data Center</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177559&Exemplar=1&LAN=DE A1 Tan, Xianguang A1 Liu, Hongmei A1 Zhang, Jiajun A1 Tian, Wenbin A1 Yu, Jiang A1 Ruan, Xingping A1 Wang, Baolin A1 Wu, Lihui A1 Zhang, Jun A1 Ahuja, Nishi YR 2023 SN 2694-2135 K1 Heating systems K1 Industries K1 Liquid cooling K1 Thermal factors K1 Cold plates K1 Government K1 Thermomechanical processes K1 Cold Plate K1 Liquid Cooling K1 Data Center K1 TDP K1 MCP and PUE SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177559 DO https://doi.org/10.1109/ITherm55368.2023.10177559 SF ELIB - SuUB Bremen
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