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1 Ergebnisse
1
Thermal Aware Floorplan Optimization of SoC in Mobile Phone:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Cho, Youngsang
;
Kim, Heonwoo.
;
Lee, Kyoungmin
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177572
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Thermal Aware Floorplan Optimization of SoC in Mobile Phone</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177572&Exemplar=1&LAN=DE A1 Cho, Youngsang A1 Kim, Heonwoo. A1 Lee, Kyoungmin A1 Im, Yunhyeok A1 Lee, Heeseok A1 Kim, Minkyu YR 2023 SN 2694-2135 K1 Heating systems K1 Temperature distribution K1 Thermal resistance K1 Simulation K1 Thermomechanical processes K1 Optimization methods K1 Real-time systems K1 Mobile K1 AP K1 SOC K1 Package K1 Thermal K1 CFD K1 Thermal resistance matrix K1 Optimization K1 Floorplan K1 Temperature map SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177572 DO https://doi.org/10.1109/ITherm55368.2023.10177572 SF ELIB - SuUB Bremen
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