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1 Ergebnisse
1
Thermal Impedance and Dynamics of Phase Change Materials un..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Lago, J.C.
;
Fernandez, V. Gonzalez
;
Barako, M.T.
. - p. 1-8 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177585
RT T1
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
: T1
Thermal Impedance and Dynamics of Phase Change Materials under Pulse Train Heating
UL https://suche.suub.uni-bremen.de/peid=ieee-10177585&Exemplar=1&LAN=DE A1 Lago, J.C. A1 Fernandez, V. Gonzalez A1 Barako, M.T. A1 Shamberger, P.J. YR 2023 SN 2694-2135 K1 Phase change materials K1 Heating systems K1 Temperature K1 Thermal resistance K1 Conductivity K1 Steady-state K1 Impedance K1 PCM/Foam Composite K1 Thermal Impedance K1 Thermal Conductivity SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177585 DO https://doi.org/10.1109/ITherm55368.2023.10177585 SF ELIB - SuUB Bremen
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