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1 Ergebnisse
1
Automated Design-for-Reliability of a Power Electronics Mod..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Paret, Paul
;
Glaws, Andrew
;
Moreno, Gilberto
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177598
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Automated Design-for-Reliability of a Power Electronics Module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177598&Exemplar=1&LAN=DE A1 Paret, Paul A1 Glaws, Andrew A1 Moreno, Gilberto A1 Major, Joshua A1 Khan, Faisal A1 Narumanchi, Sreekant YR 2023 SN 2694-2135 K1 Geometry K1 Dimensionality reduction K1 Computational modeling K1 Thermomechanical processes K1 Materials reliability K1 Reliability engineering K1 Electronic packaging thermal management K1 power electronics K1 thermomechanical modeling K1 dimensionality reduction K1 design-for-reliability SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177598 DO https://doi.org/10.1109/ITherm55368.2023.10177598 SF ELIB - SuUB Bremen
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