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High Power Advanced Package with Water Cooling System Evalu..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Lin, Shane ; Lin, Dan ; Lin, Vito... - p. 1-5 , 2023
Link: https://doi.org/10.1109/ITherm55368.2023.10177648