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1 Ergebnisse
1
Investigation on Immersion Cooling Solution for Hyper-scale..:
, In:
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Wang, Yulong
;
Gui, Chenglong
;
Cheng, Pengfei
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/ITherm55368.2023.10177671
RT T1 <cTitle>2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Investigation on Immersion Cooling Solution for Hyper-scale Data Center Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10177671&Exemplar=1&LAN=DE A1 Wang, Yulong A1 Gui, Chenglong A1 Cheng, Pengfei A1 Shen, Chen A1 Wang, Ruidong A1 Lv, Zhichao A1 Lin, Bin A1 Tian, Wenbin A1 Li, Zhiming A1 Zhang, Xu A1 Zhang, Ken A1 Wu, Lihui A1 Ahuja, Nishi YR 2023 SN 2694-2135 K1 Data centers K1 Cloud computing K1 Cooling K1 Thermomechanical processes K1 Immersion cooling K1 Thermal conductivity K1 Volcanoes K1 Single-Phase Immersion Cooling K1 Data Center K1 Cloud Computing and PUE SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ITherm55368.2023.10177671 DO https://doi.org/10.1109/ITherm55368.2023.10177671 SF ELIB - SuUB Bremen
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