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1 Ergebnisse
1
Micro Level Dimensionality Measurement for Product Inspecti..:
, In:
2023 Fifth International Conference on Electrical, Computer and Communication Technologies (ICECCT)
,
V, Nirmala
;
S, Ramakrishnan
;
R, Aadharsh
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICECCT56650.2023.10179782
RT T1 <cTitle>2023 Fifth International Conference on Electrical, Computer and Communication Technologies (ICECCT)</cTitle>: T1 <Title>Micro Level Dimensionality Measurement for Product Inspection using Machine Vision</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10179782&Exemplar=1&LAN=DE A1 V, Nirmala A1 S, Ramakrishnan A1 R, Aadharsh A1 V, Shivnarayan A1 B, Visveswaran A1 S, Prabu YR 2023 K1 Visualization K1 Machine vision K1 Inspection K1 Fasteners K1 Valves K1 Mechanical variables measurement K1 Safety K1 Deep Learning K1 Photogrammetry K1 Micro level inspection K1 Defect detection K1 Sub-Pixel processing K1 Image enhancement SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICECCT56650.2023.10179782 DO https://doi.org/10.1109/ICECCT56650.2023.10179782 SF ELIB - SuUB Bremen
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