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1 Ergebnisse
1
A 3.36 µm-pitch SPAD photon-counting image sensor using clu..:
, In:
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Takatsuka, T.
;
Ogi, J.
;
Ikeda, Y.
... - p. 1-2 , 2023
Link:
https://doi.org/10.23919/VLSITechnologyandCir57934.202..
RT T1 <cTitle>2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>A 3.36 µm-pitch SPAD photon-counting image sensor using clustered multi-cycle clocked recharging technique with intermediate most-significant-bit readout</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10185241&Exemplar=1&LAN=DE A1 Takatsuka, T. A1 Ogi, J. A1 Ikeda, Y. A1 Hizu, K. A1 Inaoka, Y. A1 Sakama, S. A1 Watanabe, I. A1 Ishikawa, T. A1 Shimada, S. A1 Suzuki, J. A1 Maeda, H. A1 Toshima, K. A1 Nonaka, Y. A1 Yamamura, A. A1 Ozawa, H. A1 Koga, F. A1 Oike, Y. YR 2023 SN 2158-9682 K1 Image sensors K1 Power demand K1 Prototypes K1 Very large scale integration K1 High dynamic range K1 Photonics K1 Single-photon avalanche diodes SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185241 DO https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185241 SF ELIB - SuUB Bremen
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