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1 Ergebnisse
1
Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integrati..:
, In:
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Chujo, Norio
;
Sakui, Koji
;
Sugatani, Shinji
... - p. 1-2 , 2023
Link:
https://doi.org/10.23919/VLSITechnologyandCir57934.202..
RT T1
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
: T1
Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy
UL https://suche.suub.uni-bremen.de/peid=ieee-10185277&Exemplar=1&LAN=DE A1 Chujo, Norio A1 Sakui, Koji A1 Sugatani, Shinji A1 Ryoson, Hiroyuki A1 Nakamura, Tomoji A1 Ohba, Takayuki YR 2023 SN 2158-9682 K1 Solid modeling K1 Three-dimensional displays K1 Power transmission lines K1 Random access memory K1 Bandwidth K1 Cows K1 Very large scale integration SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185277 DO https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185277 SF ELIB - SuUB Bremen
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