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1 Ergebnisse
1
2D Materials in the BEOL:
, In:
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Naylor, C. H.
;
Maxey, K.
;
Jezewski, C.
... - p. 1-2 , 2023
Link:
https://doi.org/10.23919/VLSITechnologyandCir57934.202..
RT T1 <cTitle>2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>2D Materials in the BEOL</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10185307&Exemplar=1&LAN=DE A1 Naylor, C. H. A1 Maxey, K. A1 Jezewski, C. A1 O'Brien, K. P. A1 Penumatcha, A. V. A1 Kavrik, M. S. A1 Agrawal, B. A1 Littlefield, C. V. A1 Lux, J. A1 Barley, B. A1 Weber, J. R. A1 Gupta, A. Sen A1 Dorow, C. J. A1 Arefin, N. A1 King, S. A1 Chebiam, R. A1 Plombon, J. A1 Clendenning, S. B. A1 Avci, U. E. A1 Kobrinsky, M. A1 Metz, M. YR 2023 SN 2158-9682 K1 Grain size K1 Temperature distribution K1 Tantalum K1 Metals K1 Very large scale integration K1 CMOS technology K1 Transition metal dichalcogenides K1 TMD K1 2D FET K1 BEOL K1 2D Barriers K1 2D CMOS SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185307 DO https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185307 SF ELIB - SuUB Bremen
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