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1 Ergebnisse
1
Structural Reliability and Performance Analysis of Backside..:
, In:
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Kim, Sunghwan
;
Kim, Geun-Myeong
;
Kim, Seong-Nam
... - p. 1-2 , 2023
Link:
https://doi.org/10.23919/VLSITechnologyandCir57934.202..
RT T1 <cTitle>2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>Structural Reliability and Performance Analysis of Backside PDN</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10185330&Exemplar=1&LAN=DE A1 Kim, Sunghwan A1 Kim, Geun-Myeong A1 Kim, Seong-Nam A1 Ahn, Saetbyeol A1 Kim, Yoon-Suk A1 Jang, Inkook A1 Lee, Kyoung-Woo A1 Kim, Dae Sin YR 2023 SN 2158-9682 K1 Ring oscillators K1 Analytical models K1 Tensile stress K1 Metals K1 Very large scale integration K1 Silicon K1 Reliability SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185330 DO https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185330 SF ELIB - SuUB Bremen
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