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1 Ergebnisse
1
Catching the Missing EM Consequence in Soft Breakdown Relia..:
, In:
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Dong, Zuoyuan
;
Sun, Zixuan
;
Yang, Xin
... - p. 1-2 , 2023
Link:
https://doi.org/10.23919/VLSITechnologyandCir57934.202..
RT T1 <cTitle>2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>Catching the Missing EM Consequence in Soft Breakdown Reliability in Advanced FinFETs: Impacts of Self-heating, On-State TDDB, and Layout Dependence</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10185380&Exemplar=1&LAN=DE A1 Dong, Zuoyuan A1 Sun, Zixuan A1 Yang, Xin A1 Li, Xiaomei A1 Xue, Yongkang A1 Luo, Chen A1 Cai, Puyang A1 Wang, Zirui A1 Wang, Shuying A1 Zhang, Yewei A1 Wang, Chaolun A1 Ren, Pengpeng A1 Ji, Zhigang A1 Wu, Xing A1 Wang, Runsheng A1 Huang, Ru YR 2023 SN 2158-9682 K1 Electromigration K1 Layout K1 Very large scale integration K1 FinFETs K1 Solids K1 Topology K1 Kinetic theory K1 TEM K1 self-heating K1 EM K1 CMOS K1 MOL SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185380 DO https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185380 SF ELIB - SuUB Bremen
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