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1 Ergebnisse
1
Molybdenum Nitride as a Scalable and Thermally Stable pWFM ..:
, In:
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
,
Arimura, H.
;
Brus, S.
;
Franco, J.
... - p. 1-2 , 2023
Link:
https://doi.org/10.23919/VLSITechnologyandCir57934.202..
RT T1 <cTitle>2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)</cTitle>: T1 <Title>Molybdenum Nitride as a Scalable and Thermally Stable pWFM for CFET</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10185430&Exemplar=1&LAN=DE A1 Arimura, H. A1 Brus, S. A1 Franco, J. A1 Oniki, Y. A1 Vandooren, A. A1 Conard, T. A1 Chan, B.-T. A1 Kannan, B. A1 Samiee, M. A1 Li, W. A1 Deminskyi, P. A1 Shero, E. A1 Bakke, J. A1 Jourdan, N. A1 Verni, G. Alessio A1 Maes, J. W. A1 Givens, M. A1 Ragnarsson, L.-A. A1 Mitard, J. A1 Litta, E. Dentoni A1 Horiguchi, N. YR 2023 SN 2158-9682 K1 Negative bias temperature instability K1 Thermal variables control K1 Very large scale integration K1 Tin K1 Logic gates K1 Molybdenum K1 Integrated circuit reliability SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185430 DO https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185430 SF ELIB - SuUB Bremen
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