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1 Ergebnisse
1
Design, Fabrication, and Far-Field Measurement of FOWLP-bas..:
, In:
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023
,
Lee, Dongseop
;
Lee, Jae-Yeong
;
Lee, Kangseop
... - p. 478-481 , 2023
Link:
https://doi.org/10.1109/IMS37964.2023.10187963
RT T1 <cTitle>2023 IEEE/MTT-S International Microwave Symposium - IMS 2023</cTitle>: T1 <Title>Design, Fabrication, and Far-Field Measurement of FOWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10187963&Exemplar=1&LAN=DE A1 Lee, Dongseop A1 Lee, Jae-Yeong A1 Lee, Kangseop A1 Kim, Minkyung A1 Kim, Myoungsun A1 Youn, Youngno A1 Song, Ho-Jin A1 Hong, Wonbin YR 2023 SN 2576-7216 K1 Antenna measurements K1 Microwave antennas K1 Wireless communication K1 Semiconductor device measurement K1 Dipole antennas K1 Loss measurement K1 Topology K1 fan-out wafer-level packaging K1 tightly coupled antenna K1 flip-chip bonding K1 heterogenous interconnection K1 over-the-air measurement SP 478 OP 481 LK http://dx.doi.org/https://doi.org/10.1109/IMS37964.2023.10187963 DO https://doi.org/10.1109/IMS37964.2023.10187963 SF ELIB - SuUB Bremen
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