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1
Use of Cavity Perturbation Techniques to Characterize Via-P..:
, In:
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023
,
Reeves, Tim
;
Tsuk, Michael
;
Iyer, Vishwanath
- p. 709-712 , 2023
Link:
https://doi.org/10.1109/IMS37964.2023.10188163
RT T1
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023
: T1
Use of Cavity Perturbation Techniques to Characterize Via-Plate Behavior
UL https://suche.suub.uni-bremen.de/peid=ieee-10188163&Exemplar=1&LAN=DE A1 Reeves, Tim A1 Tsuk, Michael A1 Iyer, Vishwanath YR 2023 SN 2576-7216 K1 Inductance K1 Perturbation methods K1 Microwave communication K1 Capacitance K1 Microwave theory and techniques K1 Behavioral sciences K1 Coaxial resonator K1 Via-plate capacitance K1 mode matching technique K1 multi-layer structures SP 709 OP 712 LK http://dx.doi.org/https://doi.org/10.1109/IMS37964.2023.10188163 DO https://doi.org/10.1109/IMS37964.2023.10188163 SF ELIB - SuUB Bremen
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