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1 Ergebnisse
1
A micro and low-cost packaging technology of high accuracy ..:
, In:
2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
,
Nie, Shaoxiao
;
Hao, Yilong
;
Meng, Fanrui
.. - p. 128-131 , 2023
Link:
https://doi.org/10.1109/NEMS57332.2023.10190892
RT T1
2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
: T1
A micro and low-cost packaging technology of high accuracy piezoresistive pressure sensors with Parylene coating
UL https://suche.suub.uni-bremen.de/peid=ieee-10190892&Exemplar=1&LAN=DE A1 Nie, Shaoxiao A1 Hao, Yilong A1 Meng, Fanrui A1 Gao, Chenhchen A1 Yang, Zhenchuan YR 2023 SN 2474-3755 K1 Pressure sensors K1 Encapsulation K1 Heat treatment K1 Nanoelectromechanical systems K1 Films K1 Sensor phenomena and characterization K1 Sensor systems K1 MEMS K1 pressure sensor K1 packaging method SP 128 OP 131 LK http://dx.doi.org/https://doi.org/10.1109/NEMS57332.2023.10190892 DO https://doi.org/10.1109/NEMS57332.2023.10190892 SF ELIB - SuUB Bremen
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