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1 Ergebnisse
1
Impact of Plasma Activation on Copper Surface Layer for Low..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Netzband, Christopher
;
Burns, Dylan
;
Tapily, Kandabara
.. - p. 350-355 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00065
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Impact of Plasma Activation on Copper Surface Layer for Low Temperature Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195245&Exemplar=1&LAN=DE A1 Netzband, Christopher A1 Burns, Dylan A1 Tapily, Kandabara A1 Ilseok, Son A1 Wajda, Cory YR 2023 SN 2377-5726 K1 Industries K1 Temperature K1 Annealing K1 Plasmas K1 Dielectrics K1 Copper K1 Plasma temperature K1 Hybrid Bonding K1 3D integration K1 Copper Oxide K1 XPS SP 350 OP 355 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00065 DO https://doi.org/10.1109/ECTC51909.2023.00065 SF ELIB - SuUB Bremen
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