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1 Ergebnisse
1
Wafer Level Capping Technology for Vacuum Packaging of Micr..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Zoschke, Kai
;
Manier, Charles Alix
;
Oppermann, Hermann
... - p. 1571-1578 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00267
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
UL https://suche.suub.uni-bremen.de/peid=ieee-10195271&Exemplar=1&LAN=DE A1 Zoschke, Kai A1 Manier, Charles Alix A1 Oppermann, Hermann A1 Meier, Dirk A1 Malik, Nishant A1 Zakizade, Elahe A1 Michel, Marvin A1 Roy, Avisek A1 Nguyen, Hoang-Vu A1 Nguyen, Thanh-Phuc YR 2023 SN 2377-5726 K1 Wafer bonding K1 Resistance K1 Structural rings K1 Vacuum technology K1 Seals K1 Packaging K1 Germanium K1 wafer level packaging K1 wafer level capping K1 hermetic sealing K1 vacuum packaging K1 MEMS packaging K1 microbolometers K1 Pirani sensors K1 permanent wafer bonding K1 temporary wafer bonding SP 1571 OP 1578 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00267 DO https://doi.org/10.1109/ECTC51909.2023.00267 SF ELIB - SuUB Bremen
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