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1 Ergebnisse
1
Voids-free Die-level Cu/ILD Hybrid bonding:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Sakuma, Katsuyuki
;
Yu, Roy
;
Polomoff, Nicholas
... - p. 800-805 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00139
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Voids-free Die-level Cu/ILD Hybrid bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195284&Exemplar=1&LAN=DE A1 Sakuma, Katsuyuki A1 Yu, Roy A1 Polomoff, Nicholas A1 Darling, Luke A1 Chowdhury, Promod A1 Raghavan, Sathya A1 Seifert, Keodara A1 Knickerbocker, John A1 McHerron, Dale A1 Li, Ming A1 So, Siu Cheung A1 Kwok, So Ying A1 Fan, Chun Ho A1 Lau, Siu Wing YR 2023 SN 2377-5726 K1 Silicon compounds K1 Moisture K1 Molecular beam epitaxial growth K1 Electronic components K1 Dielectrics K1 Dielectric films K1 Bonding K1 Hybrid bonding K1 Cu/ILD K1 Void-free K1 die-to-die K1 die-to-wafer K1 Zhuravlev model SP 800 OP 805 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00139 DO https://doi.org/10.1109/ECTC51909.2023.00139 SF ELIB - SuUB Bremen
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