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High-temperature creep properties of a novel solder materia..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Du, Leiming ; Zhao, Xiujuan ; Poelma, Rene.. - p. 392-395 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00072