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1 Ergebnisse
1
Addressing sub-micron thermal warpage: Industrial applicati..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Safia, Benkoula
;
Pierre, Vernhes
;
Nicolas, Choisel
... - p. 169-174 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00037
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Addressing sub-micron thermal warpage: Industrial application on semiconductor devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195294&Exemplar=1&LAN=DE A1 Safia, Benkoula A1 Pierre, Vernhes A1 Nicolas, Choisel A1 Regis, Braisaz A1 Rodolfo, Cruz A1 Stephanie, Rey A1 Fabien, Quercia YR 2023 SN 2377-5726 K1 Reflectivity K1 Optical interferometry K1 Image resolution K1 Optical device fabrication K1 Surface emitting lasers K1 Optical variables measurement K1 Optical imaging K1 warpage K1 reflow K1 assembly K1 integration K1 die attach optical attach SP 169 OP 174 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00037 DO https://doi.org/10.1109/ECTC51909.2023.00037 SF ELIB - SuUB Bremen
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