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Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applica..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Yeongseon ; Kim, Juhyeon ; Kim, Hyoeun... - p. 1043-1047 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00178