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1 Ergebnisse
1
A Novel Polymer-Based Ultra-High Density Bonding Interconne..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Lin, Yu-Min
;
Yang, Tsung-Yu Ou
;
Lee, Ou-Hsiang
... - p. 1779-1784 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00304
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel Polymer-Based Ultra-High Density Bonding Interconnection</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195301&Exemplar=1&LAN=DE A1 Lin, Yu-Min A1 Yang, Tsung-Yu Ou A1 Lee, Ou-Hsiang A1 Lee, Ching- Kuan A1 Ko, Hsiu-Kuei A1 Chen, Yi-Shu A1 Chang, Hsiang-Hung A1 Gallagher, Michael A1 Gilmore, Christopher A1 Chuang, Po-Yao A1 Tseng, Ying-Chung A1 Tsai, Po-Hao A1 Huang, Po-Chun A1 Lee, Chang-Chun YR 2023 SN 2377-5726 K1 Temperature sensors K1 Thermal expansion K1 Three-dimensional displays K1 Temperature K1 Stacking K1 Dielectric materials K1 Polymers K1 hybrid bond K1 organic material K1 Chemical Mechanical Planarization K1 assembly SP 1779 OP 1784 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00304 DO https://doi.org/10.1109/ECTC51909.2023.00304 SF ELIB - SuUB Bremen
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