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1 Ergebnisse
1
Design-for-Manufacturing and Design-for-Reliability Strateg..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Su, Peng
;
Ahmed, Omar
;
Hutchinson, Leif
.. - p. 706-712 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00123
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Design-for-Manufacturing and Design-for-Reliability Strategies for Large 80mm+ 2.5D Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195318&Exemplar=1&LAN=DE A1 Su, Peng A1 Ahmed, Omar A1 Hutchinson, Leif A1 Glasauer, Bernard A1 Ganguly, Gautam YR 2023 SN 2377-5726 K1 Measurement K1 Semiconductor devices K1 Printed circuits K1 Performance gain K1 Packaging K1 Reliability engineering K1 Silicon K1 2.5D package K1 component warpage K1 solder joint reliability K1 finite element simulation K1 thermal solutions SP 706 OP 712 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00123 DO https://doi.org/10.1109/ECTC51909.2023.00123 SF ELIB - SuUB Bremen
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