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1 Ergebnisse
1
Supercarrier Redistribution Layers to Realize Ultra Large 2..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Hou, S. Y.
;
Lee, Chien Hsun
;
Wang, Tsung-Ding
.. - p. 510-514 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00091
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Supercarrier Redistribution Layers to Realize Ultra Large 2.5D Wafer Scale Packaging by CoWoS
UL https://suche.suub.uni-bremen.de/peid=ieee-10195320&Exemplar=1&LAN=DE A1 Hou, S. Y. A1 Lee, Chien Hsun A1 Wang, Tsung-Ding A1 Hou, Hao Cheng A1 Hu, Hsieh-Pin YR 2023 SN 2377-5726 K1 TV K1 Stability criteria K1 Packaging K1 Routing K1 Silicon K1 Transistors K1 Reliability K1 CoWoS K1 interposer K1 2.5D K1 HPC K1 super carrier (SC) RDL K1 LSI K1 HBM K1 uBGA K1 COP K1 metal TIM SP 510 OP 514 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00091 DO https://doi.org/10.1109/ECTC51909.2023.00091 SF ELIB - SuUB Bremen
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