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Supercarrier Redistribution Layers to Realize Ultra Large 2..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hou, S. Y. ; Lee, Chien Hsun ; Wang, Tsung-Ding.. - p. 510-514 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00091