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1 Ergebnisse
1
Artificial Intelligence (AI) based methodology to minimize ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Raghavan, Sathya
;
Mori, Hiroyuki
;
Bonilla, Griselda
. - p. 1213-1218 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00207
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
UL https://suche.suub.uni-bremen.de/peid=ieee-10195325&Exemplar=1&LAN=DE A1 Raghavan, Sathya A1 Mori, Hiroyuki A1 Bonilla, Griselda A1 Sakuma, Katsuyuki YR 2023 SN 2377-5726 K1 Semiconductor device modeling K1 Technological innovation K1 Solid modeling K1 Predictive models K1 Silicon K1 Hardware K1 Finite element analysis K1 heterogeneous integration K1 fine-pitch organic substrates K1 substrate warpage reduction K1 copper volume percent optimization K1 machine learning SP 1213 OP 1218 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00207 DO https://doi.org/10.1109/ECTC51909.2023.00207 SF ELIB - SuUB Bremen
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