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A Novel Indium Metal Thermal Interface Material and Package..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Chang, Kuo-Chin ; Lii, Mirng-Ji ; Wang, Kuan-Min.. - p. 2079-2086 , 2023

Link: https://doi.org/10.1109/ECTC51909.2023.00356

RT 
T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel Indium Metal Thermal Interface Material and Package Design Configuration to Enhance High-Power Advanced Si Packages Thermal Performance</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10195331&Exemplar=1&LAN=DE
				
A1 Chang, Kuo-Chin
A1 Lii, Mirng-Ji
A1 Wang, Kuan-Min
A1 Wang, Chien-Chang
A1 Wu, Bang-Li
YR 2023
SN 2377-5726
K1 Temperature measurement
K1 Semiconductor device measurement
K1 Thermal resistance
K1 Packaging
K1 Electronic packaging thermal management
K1 Thermal conductivity
K1 Silicon
K1 High performance computing (HPC) flip chip package
K1 indium metal thermal interface material
K1 thermal resistance theta-JC
K1 plunger with water cooling system
K1 computational thermal modeling technique method
K1 high power dissipation
K1 and junction temperature
SP 2079
OP 2086
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00356
DO https://doi.org/10.1109/ECTC51909.2023.00356
SF ELIB - SuUB Bremen

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