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Reliability Performance on Fine-Pitch SoIC™ Bond:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Liang, S. W. ; Liang, Y.R. ; Wu, Gene C. Y.... - p. 783-787 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00136