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Volume-controllable Solder Bumping Technology to Package Su..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Aoki, Toyohiro ; Sakuma, Katsuyuki ; Mori, Hiroyuki.. - p. 585-589 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00103