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1 Ergebnisse
1
Reliability Performance of S-Connect Module (Bridge Technol..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Jang, Heejun
;
Ahn, Kyun
;
Park, Haesung
... - p. 1027-1031 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00175
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195345&Exemplar=1&LAN=DE A1 Jang, Heejun A1 Ahn, Kyun A1 Park, Haesung A1 Yong, Gamhan A1 Kim, Jihyun A1 Jeong, YeonKi A1 Sohn, EunSook A1 Hiner, Dave A1 Kelly, Mike A1 Hwang, Taekyeong A1 Do, Wonchul A1 Khim, JinYoung YR 2023 SN 2377-5726 K1 Thermal resistance K1 Bridge circuits K1 Multichip modules K1 Silicon K1 Power system reliability K1 System-on-chip K1 Soldering K1 S-Connect K1 Bridge technology K1 Heterogeneous integration K1 Reliability SP 1027 OP 1031 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00175 DO https://doi.org/10.1109/ECTC51909.2023.00175 SF ELIB - SuUB Bremen
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