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1 Ergebnisse
1
Integration And Process Challenges Of Self Assembly Applied..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Bourjot, Emilie
;
Bond, Alice
;
Nadi, Noura
... - p. 1397-1402 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00239
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195354&Exemplar=1&LAN=DE A1 Bourjot, Emilie A1 Bond, Alice A1 Nadi, Noura A1 Enot, Thierry A1 Sanchez, Loic A1 Montmeat, Pierre A1 Martin, Benoit A1 Campo, Alain A1 Fournel, Frank A1 Eid, Feras A1 Swan, Johanna YR 2023 SN 2377-5726 K1 Fabrication K1 Degradation K1 Self-assembly K1 Electronic components K1 Resists K1 Ions K1 Oxidation K1 die-to-wafer K1 hybrid bonding K1 self assembly SP 1397 OP 1402 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00239 DO https://doi.org/10.1109/ECTC51909.2023.00239 SF ELIB - SuUB Bremen
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