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Process Design Kit and Initial Demonstration of Digital Met..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Nadri, Souheil ; Tu, B-A. Clayton ; Herrault, Florian... - p. 623-628 , 2023

Link: https://doi.org/10.1109/ECTC51909.2023.00110

RT 
T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10195363&Exemplar=1&LAN=DE
				
A1 Nadri, Souheil
A1 Tu, B-A. Clayton
A1 Herrault, Florian
A1 Sharifi, Hasan
A1 McCue, Jamin
A1 Khan, Abdullah
A1 Schwan, David
A1 Botticello, David
A1 Das, Sanjana
A1 Kuzmenko, Daniel
A1 Wong, Joel
A1 Phan, Vu
A1 Nguyen, Jason
A1 Wilt, Courtney
YR 2023
SN 2377-5726
K1 Process design
K1 Electronic components
K1 Packaging
K1 Thermal management
K1 Electronic packaging thermal management
K1 Silicon
K1 Copper
K1 fan-out
K1 wafer-level package
K1 fine-pitch
K1 CMOS chips
K1 silicon interposer
K1 electroplated copper
K1 heat spreader
K1 Process Design Kit
SP 623
OP 628
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00110
DO https://doi.org/10.1109/ECTC51909.2023.00110
SF ELIB - SuUB Bremen

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