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1 Ergebnisse
1
Modeling of the Temperature Profile and Residual Stress Dur..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Chowdhury, Prabudhya Roy
;
Raghavan, Sathya
;
Darling, Luke
... - p. 1418-1425 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00242
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195371&Exemplar=1&LAN=DE A1 Chowdhury, Prabudhya Roy A1 Raghavan, Sathya A1 Darling, Luke A1 Jain, Aakrati A1 Chowdhury, Promod R. A1 Farooq, Mukta Ghate A1 Sakuma, Katsuyuki YR 2023 SN 2377-5726 K1 Heating systems K1 Temperature distribution K1 Solid modeling K1 Three-dimensional displays K1 Thermal resistance K1 Silicon K1 Residual stresses K1 3D packaging K1 Thermal Compression Bonding K1 Thermo-mechanical modeling K1 Optimization K1 Residual Stress SP 1418 OP 1425 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00242 DO https://doi.org/10.1109/ECTC51909.2023.00242 SF ELIB - SuUB Bremen
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