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1 Ergebnisse
1
A Fully Additive Fabrication Approach for sub-10-Micrometer..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Imani, Roghayeh
;
Chouhan, Shailesh
;
Putaala, Jussi
... - p. 1926-1931 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00331
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Fully Additive Fabrication Approach for sub-10-Micrometer Microvia Suitable for 3-D System-in-Package Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195374&Exemplar=1&LAN=DE A1 Imani, Roghayeh A1 Chouhan, Shailesh A1 Putaala, Jussi A1 Nousiainen, Olli A1 Hagberg, Juha A1 Myllymaki, Sami A1 Acharya, Sarthak A1 Jantunen, Heli A1 Delsing, Jerker YR 2023 SN 2377-5726 K1 Scanning electron microscopy K1 Additives K1 Optical microscopy K1 System-in-package K1 Microscopy K1 Optical device fabrication K1 Plating K1 microvia K1 picosecond pulsed ultraviolet laser K1 additive manufacturing K1 copper plating SP 1926 OP 1931 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00331 DO https://doi.org/10.1109/ECTC51909.2023.00331 SF ELIB - SuUB Bremen
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