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1 Ergebnisse
1
The Advantages of Low temperature (<400°C) Carbon Nano-Tube..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Basu, Nilabh
;
Lin, Hong-Yi
;
Chen, Ting-Wei
... - p. 1164-1169 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00199
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>The Advantages of Low temperature (<400°C) Carbon Nano-Tubes (CNTs) as Through Silicon Vias (TSVs) in Multi-Layer Stacking and Backside Power-Via Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195378&Exemplar=1&LAN=DE A1 Basu, Nilabh A1 Lin, Hong-Yi A1 Chen, Ting-Wei A1 Chan, Yi-Cheng A1 Tsai, Yi-Ting A1 Guo, Hong-Cheng A1 Wu, Tung-Han A1 Lin, Pin-Chi A1 Lin, Yu-Cheng A1 Liao, Ming-Han YR 2023 SN 2377-5726 K1 Temperature K1 Simulation K1 Stacking K1 Conductivity K1 Thermal conductivity K1 Contact resistance K1 Silicon K1 3DIC K1 CNT K1 TSV K1 Signal Integrity K1 Power Integrity K1 Backside Power Delivery SP 1164 OP 1169 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00199 DO https://doi.org/10.1109/ECTC51909.2023.00199 SF ELIB - SuUB Bremen
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