I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Comparative Mechanical Behavior of Sn-Bi based Low Temperat..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
P.L., Sukshitha Achar
;
Greene, Colin V.
;
Lai, Sean Yenyu
... - p. 2218-2222 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00384
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Comparative Mechanical Behavior of Sn-Bi based Low Temperature Solder Alloys under Different Pretest Aging Conditions
UL https://suche.suub.uni-bremen.de/peid=ieee-10195381&Exemplar=1&LAN=DE A1 P.L., Sukshitha Achar A1 Greene, Colin V. A1 Lai, Sean Yenyu A1 Radulescu, Radu A1 Fowler, Hannah A1 Blendell, John A1 Handwerker, Carol A1 Subbarayan, Ganesh A1 Badwe, Nilesh YR 2023 SN 2377-5726 K1 Temperature K1 Metals K1 Electronic components K1 Aging K1 Reliability engineering K1 Fatigue K1 Behavioral sciences K1 Low temperature alloys K1 eutectic SnBi K1 SAC K1 microalloys K1 solder joint reliability K1 mechanical characterization K1 constitutive behavior K1 fatigue life SP 2218 OP 2222 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00384 DO https://doi.org/10.1109/ECTC51909.2023.00384 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)