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Residual stress measurement of build-up layer in silicon wa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yang, Junbo ; Cai, Chongyang ; Lai, Yangyang... - p. 303-309 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00058