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1 Ergebnisse
1
New interconnection technologies based on Ni nano-particle ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Tanaka, Yasunori
;
Furuya, Shun
;
Koshiba, Keiko
... - p. 1832-1837 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00314
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>New interconnection technologies based on Ni nano-particle and Ni micro-plating bonding with stress relaxation effect for high-temperature resistant power device packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195384&Exemplar=1&LAN=DE A1 Tanaka, Yasunori A1 Furuya, Shun A1 Koshiba, Keiko A1 Kitaguchi, Yuya A1 Hino, Yasunari A1 Miyagawa, Mayu A1 Iizuka, Tomonori A1 Tatsumi, Kohei YR 2023 SN 2377-5726 K1 Thermal expansion K1 Silicon carbide K1 Thermal resistance K1 Plating K1 Electronic packaging thermal management K1 Thermal conductivity K1 Nickel K1 Inverter Module K1 Ni nanoparticle Micro-plating K1 NMPB K1 SiC K1 Ni K1 MOS-FET K1 SBD K1 Inverter K1 Cu lead K1 Power module K1 Chevron Shape K1 Invar alloy SP 1832 OP 1837 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00314 DO https://doi.org/10.1109/ECTC51909.2023.00314 SF ELIB - SuUB Bremen
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