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1 Ergebnisse
1
Low Temperature Fine Pitch All-Copper Interconnects Combini..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Ji, Xinrui
;
Van Zeijl, Henk
;
Jiao, Weiping
... - p. 1237-1243 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00211
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195386&Exemplar=1&LAN=DE A1 Ji, Xinrui A1 Van Zeijl, Henk A1 Jiao, Weiping A1 He, Shan A1 Du, Leiming A1 Zhang, Guoqi YR 2023 SN 2377-5726 K1 Resistance K1 Temperature measurement K1 Young's modulus K1 Temperature dependence K1 Sintering K1 Conductivity K1 Flip-chip devices K1 copper nanoparticles K1 flip chip K1 underfill K1 epoxy-based photoresist K1 all-Cu interconnects SP 1237 OP 1243 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00211 DO https://doi.org/10.1109/ECTC51909.2023.00211 SF ELIB - SuUB Bremen
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