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1 Ergebnisse
1
First Demonstration of Die-embedded Alumina Ribbon Ceramic ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kim, Joon Woo
;
Aslani-Amoli, Nahid
;
Liu, Fuhan
... - p. 1939-1943 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00333
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
First Demonstration of Die-embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-10195395&Exemplar=1&LAN=DE A1 Kim, Joon Woo A1 Aslani-Amoli, Nahid A1 Liu, Fuhan A1 Vaddi, Rajesh A1 Nagar, Garima C. A1 Swaminathan, Madhavan YR 2023 SN 2377-5726 K1 Temperature measurement K1 6G mobile communication K1 Micrometers K1 Dielectric constant K1 Temperature K1 Dielectric loss measurement K1 Ceramics K1 Alumina ribbon ceramic K1 ARC K1 bonding K1 chip embedding K1 heterogeneous integration K1 electronics packaging K1 6G applications SP 1939 OP 1943 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00333 DO https://doi.org/10.1109/ECTC51909.2023.00333 SF ELIB - SuUB Bremen
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