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1 Ergebnisse
1
Thermal Improvement of HBM with Joint Thermal Resistance Re..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kim, Taehwan
;
Lee, Jonggyu
;
Kim, Youngdeuk
... - p. 767-771 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00133
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195397&Exemplar=1&LAN=DE A1 Kim, Taehwan A1 Lee, Jonggyu A1 Kim, Youngdeuk A1 Park, Hwanjoo A1 Hwang, Heejung A1 Kim, Jaechoon A1 Jung, Hangi A1 Kim, Dong Wook YR 2023 SN 2377-5726 K1 Temperature sensors K1 Temperature K1 Thermal resistance K1 Bandwidth K1 Electronic packaging thermal management K1 Thermal analysis K1 Temperature control K1 High bandwidth memory (HBM) K1 Thermal characteristics K1 Stack thermal resistance K1 Thermocompression bonding K1 Hybrid copper bonding K1 multi-chip package SP 767 OP 771 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00133 DO https://doi.org/10.1109/ECTC51909.2023.00133 SF ELIB - SuUB Bremen
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