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1 Ergebnisse
1
Comparable Study for Redistribution Layers in FO POP RDL Fi..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kuo Frank, Kuei Hsiao
;
Tai, Derrick
;
Peng, Sam
. - p. 253-257 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00391
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Comparable Study for Redistribution Layers in FO POP RDL First and Last (Fan-Out Package on Package)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195399&Exemplar=1&LAN=DE A1 Kuo Frank, Kuei Hsiao A1 Tai, Derrick A1 Peng, Sam A1 Chien, Feng Lung YR 2023 SN 2377-5726 K1 Fabrication K1 Encapsulation K1 Legged locomotion K1 Manufacturing processes K1 Semiconductor device reliability K1 Metals K1 Thermal management K1 redistribution layer (RDL) K1 fan-out package on package (FO-POP) K1 bottom redistribution layer (BTM RDL) K1 top redistribution layer (TOP RDL) SP 253 OP 257 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00391 DO https://doi.org/10.1109/ECTC51909.2023.00391 SF ELIB - SuUB Bremen
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